DFD6340
Standard dual spindle dicing saw
• Φ200 mm • Facing dual spindle • DBG • Package Singulation
Maximized throughput
The DFD6340 features a facing dual-spindle configuration with a shorter distance between blades, which improves throughput by up to 30 % for step/bevel cut and 40 % for dual cut when compared with parallel dual spindle dicing saws.
Small footprint
By employing a new high-rigidity, bridge-type frame structure, the DFD6340 has the smallest footprint of any 8" saw in its class.
Shorter set up time - two NCS* sensors
Two Non-Contact Setup sensors, one each for Z1 & Z2, enables increased throughput.
※ optional function
Process stability - cutting water flow control
Cutting water flow rate can be set in the device data. In addition, water flow rate is monitored during processing, making it possible to ensure a constant and stable flow rate.
Shorter kerf check time - two microscopes*
A dedicated high-magnification microscope for each spindle allows for simultaneous kerf checking for increased throughput.
* optional function
Easy operation
The DFD6340 utilizes an adjustable LCD touch screen graphical user interface making operation and maintenance intuitive and easy. The inclusion of an inspection stage allows for the removal and checking of wafers after dicing during fully automatic operation.
* optional function
Easy operation
The DFD6340 utilizes an adjustable LCD touch screen graphical user interface making operation and maintenance intuitive and easy. The inclusion of an inspection stage allows for the removal and checking of wafers after dicing during fully automatic operation.
DFD6560 operation flow
- Lower arm moves the workpiece from the cassette to the pre-alignment stage. Lower arm moves the workpiece to the chuck table → cutting →
- Upper arm moves the workpiece to the spinner table → cleaning & drying →
- Lower arm returns the workpiece to the cassette
