Our Capability
• 310 sq. m. production facility
• Class 10K Cleanroom environment
• 8,000 wafers/month wafer backgrind capacity
• 13,000 wafers/month wafer saw capacity
• Class 10K Cleanroom environment
• 8,000 wafers/month wafer backgrind capacity
• 13,000 wafers/month wafer saw capacity
Existing Equipment BG and Saw
DFD6361
Fully Automatic Dicing Saw
The DFD6361 enhances throughput in two distinct ways. DISCO’s facing dual design and a reduction in distance between the blades help to control total cut time, while high-magnification microscopes (standard) and non-contact setup sensors (option) for both Z1 and Z2 reduce the time required for non-dicing sequences, such as kerf check and blade setup.
The DFD6361 enhances throughput in two distinct ways. DISCO’s facing dual design and a reduction in distance between the blades help to control total cut time, while high-magnification microscopes (standard) and non-contact setup sensors (option) for both Z1 and Z2 reduce the time required for non-dicing sequences, such as kerf check and blade setup.
DFD6560
Fully Automatic Dicing Saw
D6560 is equipped with uniquely developed short spindles and an optimized bridge-type frame structure resulting in a 16% reduced footprint. All maintenance can be performed from the front of the equipment, thus reducing the area needed for installation and maintenance areas by 20% (compared to the DFD6362).
D6560 is equipped with uniquely developed short spindles and an optimized bridge-type frame structure resulting in a 16% reduced footprint. All maintenance can be performed from the front of the equipment, thus reducing the area needed for installation and maintenance areas by 20% (compared to the DFD6362).
DGP8761
Fully Automatic Grinder/Polisher - Planned Equipment
The DGP8761 is the successor to the DGP8760, which is used by premier manufacturers worldwide. It integrates backside grinding and stress relief processing and performs stable thin grinding to thicknesses less than 25 µm. The DGP8761 is equipped with a newly developed spindle to support high-speed grinding.
The DGP8761 is the successor to the DGP8760, which is used by premier manufacturers worldwide. It integrates backside grinding and stress relief processing and performs stable thin grinding to thicknesses less than 25 µm. The DGP8761 is equipped with a newly developed spindle to support high-speed grinding.
DFD6340
Taiko Ring Cut Saw
The DFD6340 features a facing dual-spindle configuration with a shorter distance between blades, which improves throughput by up to 30 % for step/bevel cut and 40 % for dual cut when compared with parallel dual spindle dicing saws. By employing a new high-rigidity, bridge-type frame structure, the DFD6340 has the smallest footprint of any 8" saw in its class.
The DFD6340 features a facing dual-spindle configuration with a shorter distance between blades, which improves throughput by up to 30 % for step/bevel cut and 40 % for dual cut when compared with parallel dual spindle dicing saws. By employing a new high-rigidity, bridge-type frame structure, the DFD6340 has the smallest footprint of any 8" saw in its class.
DFM2800
Fully Automatic Multifunction Wafer Mounter
The DFM2800 is a specialized wafer mounter for inclusion in an inline system with a backgrinder to process Φ300 mm ultra-thin wafers. It mounts wafers that have been thinned with the DGP8761 system onto dicing tape or tape frames and removes the front side protection tape in a stable process. It also supports the attachment of DAF with integrated dicing tape,
The DFM2800 is a specialized wafer mounter for inclusion in an inline system with a backgrinder to process Φ300 mm ultra-thin wafers. It mounts wafers that have been thinned with the DGP8761 system onto dicing tape or tape frames and removes the front side protection tape in a stable process. It also supports the attachment of DAF with integrated dicing tape,
Certifications
