DGP8761

Fully Automatic Grinder/Polisher

High-efficiency grinder/polisher for Φ300 mm wafers
• Φ300 mm   • 3 axes, 4 chuck tables   • DBG   • SDBG   • Wafer Thinning   • Stress Releaf


Realizes improvements in process stability and higher throughput
The DGP8761 is the successor to the DGP8760, which is used by premier manufacturers worldwide. It integrates backside grinding and stress relief processing and performs stable thin grinding to thicknesses less than 25 µm. The DGP8761 is equipped with a newly developed spindle to support high-speed grinding. This contributes to a shorter thin wafer processing time (compared to the DGP8760). In addition, an optimized handling layout shortens the cycle time (not including processing time).


Various Z3 spindle configurations
The following Z3 spindle configurations for thin wafer processing can be selected:


Stress relief
  • Dry polishing - an environmentally friendly process without chemicals or water
  • CMP (optional)

Superfine grinding (optional)
  • Poligrind
  • UltraPoligrind
DFG8540
Improved throughput
A thin wheel cover was adopted and the distance between the blades was reduced, leading to an increase in the number of lines that can be cut simultaneously.Thus cut time is reduced by a maximum of approximately 10 %. (compared to the DFD6362).
Thorough options for particle prevention
Users can select optional particle prevention measures used in other models, such as the cut section atomizing nozzle and spinner atomizing nozzle. A chuck table water curtain, which prevents particle adhesion caused by wafer drying, is also available.
Concentrated maintenance area
All operations, from routine to maintenance, can be performed from the front of the equipment. The space reduction achieved in the DFD6560 allows 5 units to be lined up in a space which would only fit 4 units for the DFD6362 at a production facility.

DFD6560 operation flow

  1. Push-pull arm moves the workpiece from the cassette to the pre-alignment stage
  2. After centering at the pre-alignment stage, the lower arm moves the workpiece to the chuck table.→
  3. Cutting →
  4. Upper arm moves the workpiece to the spinner table →
  5. Cleaning and drying → Lower arm moves the workpiece to the pre-alignment stage →
  6. Push-pull arm returns the workpiece to the cassette.
Image